Knowledge of the common models about eMMC/eMCP IC test socket adapter!!

Knowledge of the common models about eMMC/eMCP IC test socket adapter!!

For Card Nand Flash Test Solution, FBGA169 / FBGA153 IC Burn-in / Function Test Socket, (11.5x13,12x16,12x18,14x18mm) specification eMMC / eMCP IC test socket.
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USB Interface output and SD test socket adapter.

Features:
1. Using the standard SD interface mode, SD connection or through the programming interface to achieve the appropriate operational test or the like through a card reader and computer programming;
2. Compatible with the ball without the ball test, IC uses a mold forming one bounding box, you can select different sizes of the bounding box to be replaced according to IC, IC can achieve different sizes General;
3. Support hot-swappable, support should be tested connected PIN via the SD interface or through a link on the board for the discharge;
4. PCB 4-layer wiring structure, reduce the use of the product in the test due to signal interference caused by unstable phenomenon, finger-thick gold plating process to ensure durability and exposure of use;
5. Also compatible with: Toshiba, Samsung, Hynix, Intel, Sandisk (SanDisk) and other brands IC
6. Beryllium copper shrapnel imported high-precision molds by stamping, head-shaped imitation probe design, late and hard, thick gold plating process to ensure product stability and durability;
7. The connection module with the overall structure, reduce duplication locate problems and ensure their points of contact with the IC PAD precise alignment, the first test pass rate;
8. Using through-hole solder structure to ensure good contact, SOCKET and PCBA accurate positioning using the positioning hole easy to replace;
9. Clamshell structure, easier manual testing, convenient and simple to operate;
10. Using the overall shape of the mold plus spring adaptive structure, to ensure that different thickness of IC does not require any adjustment to ensure good contact IC test universal wide (thickness 0.6-2.0MM range can be tested);
11. A structure using injection molding, precision positioning, pick and place convenient IC, work more efficiently;




Pitch e(mm) Pin Cout PackageSize(mm) Part Number
0.5      153/169   11.5*13         eMMC 153 / eMMC 169
0.5      162/186   12*12 eMCP 162 / eMMC 186
0.5      153/169   11.5*13 eMMC 153/ eMMC 169
0.5      162/186   11.5*13 eMCP 162 / eMMC 186
0.5       30   11.5*13   eMMC 153/ eMMC 169
0.5       30     12*16   eMCP 162/ eMMC186
0.5       30   11.5*13     eMMC153/169
0.5       35     11.5*13 eMCP162/186
0.5       30   11.5*13 eMMC153/169
0.5       35   14*18 eMCP162/186
0.5       30   12*18 eMCP162/186